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DPS-081104
CHIP BEADS
Ultra Power Line Series
v Features
* High Current characteristics * Low Rdc characteristics * Good reliability (Monolithic structure) * Magnetically shielded * Fast mounting speed * RoHS compliant
W L
v Dimensions
B
(unit : mm)
T
v Applications
* PDP/LCD Monitor, Digital TV/VCR etc.
Size 1005 1608 2012
L 1.00.10 1.60.15 2.00.20 3.20.20 4.50.25 4.50.25
W 0.50.10 0.80.15 1.250.2 1.60.20 1.60.20 3.20.25
T 0.50.10 0.80.15 0.850.2 1.10.20 1.30.20 1.50.25
B 0.250.1 0.30.2 0.50.3 0.50.3 0.50.3 0.50.3
v General Code
CB
1
3216
2012
2
U
3
A
4
300
5
T
6
4516 4532
1
2
3
4
5
6
Series Code CB : Chip Ferrite Beads Dimension Code The first two digits : length(mm) The last two digits : width(mm) Application Code G : Signal Line P : High Current Line U : Ultra High Current Line Material Code A: General Frequency K,J: Medium Frequency M: High Frequency V: Very High Frequency Impedance Value Code The first two digits represents significant The last digit is the number of zeros following ex) 300 = 30 () Packaging Code T : Reel paper packaging E : Reel embossed tape packaging
v Temperature Range
* Operating Temp. -55 ~ +125 * Storage Temp. -10 ~ +40
v Typical Material Characteristics
High
(Low RXCP)
Low
(High RXCP)
V M J,K A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
Impedance () 25% 100 50 60 30 60 100 120 120 120 120 120 60 120 60 120 400 DC Resistance () max. 0.030 0.025 0.030 0.010 0.015 0.020 0.030 0.030 0.030 0.030 0.020 0.010 0.200 0.010 0.030 0.045 Rated Current (mA) max. 4000 4000 4000 5000 5000 4000 Test Frequency (MHz)
Samwha P/N CB1608UA101 CB1608UK500 CB1608UK600 CB2012UA300 CB2012UA600 CB2012UA101 CB2012UA121 CB2012UK121 CB2012UJ121 CB2012UM121 CB3216UA121 CB3216UM600 CB3216UM121 CB4516UM600 CB4532UK121 CB4532UK401
CHIP BEAD, Ultra Power Line Series
4000 4000 4000 4000 6000 6000 6000 6000 6000 4000 100
Measuring Equipment -. Z : HP4291B / E4991A -. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Ultra Power Line
v 1608~4532 SIZE
CB 1608 UK 500
100 100
CB 1608 UK 600
Z Z Impedance [ O ]
75
Impedance [ O ]
75
R
R
50
50
X
25
25
X
1 10 100 1000
0 1 10 100 1000
0
Frequency [MHz]
Frequency [MHz]
60
CB 2012 UA 300
Impedance [Ohm]
120
CB 2012 UA 101
Z Impedance [Ohm] R
200
CB 2012 UK 121
Z R
CHIP BEAD, Ultra Power Line Series
Impedance [Ohm]
45
90
150
Z
30
60
100
R
15
X
1 10 100 1000
30
50
X
X
0 1 10 100 1000
0
0
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
200
CB 2012 UJ 121
Z
160
CB 2012 UM 121
Z
Impedance [ ]
Impedance [ O ]
150
120
R
100
R
80
X
50
X
40
0
0
1 10 100 1000
1
10
100
1000
Frequency [MHz]
Frequency[MHz]
180
CB 3216 UA 121
Z
160
CB 3216 UM 121
Z
Impedance [ O ]
280
CB 4532 UK 121
Z R
Impedance [ ]
Impedance [ O ]
135
R
120
210
R
80
90
140
X
40
45
X
70
X
0
0
1 10 100 1000
1
10
100
1000
0
1
10
100
1000
Frequency [MHz]
Frequency[MHz]
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Operating temperature range Storage temperature range
Requirements
- 55 ~ + 125 40 max., 70% RH max.
Test Conditions
at packing condition Preheat temperature : 100 ~ 150 Preheat time : 60 sec. Solder temperature : 245 5 Soldering time : 10 1 sec.
Solderability
More than 90% of the terminal electrode shall be covered with new solder
CHIP BEAD, Reliability & Test Condition
Resistance to soldering heat
1. No damage such as cracks should be caused in chip element 2. More than 75% of the terminal electrode shall be covered with new solder 3. Impedance shall not change more than 30 % More than 50% of the terminal electrode shall be covered with new solder
Preheat temperature : 100 ~ 150 Preheat time : 60 sec. Solder temperature : 270 10 Soldering time : 10 0.5 sec.
Reflow soldering
ST ST
1 CT 2 CT
Preheat temperature : 150 Preheat time : 60 sec. Solder temperature : 245 5 Soldering time : 10 sec. max. (Reflow soldering profile)
High temperature resistance
Temperature : 125 3 Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 125 3 Applied current : rated current Time : 1000 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : 40 2 Humidity : 90 2 % RH Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours
High temperature load resistance
1. No mechanical damage 2. Impedance shall not change more than 30 %
Humidity resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item Requirements Test Conditions
Temperature : 40 2 Humidity : 90 2 % RH Applied current : rated current Time : 500 12 hours Measurement at room ambient temperature after placing for 24 hours Temperature : -55 3 Time : 1000 12 hours Measurement at room ambient temperature after placing for 24 hours 1. -55 3 for 30 minutes 2.125 3 for 30 minutes 3. repeat 100 cycle Frequency : 10 ~ 55 Hz Amplitude : 1.5 mm Direction : X, Y, Z Sweep time : 2 hours for each axis Drop 10 times on a concrete floor from a height of 100 cm No mechanical damage
ITEM A (mm) B (mm) C (mm) W (kgf)
1005 1608 2012 3216 4516 4532
Humidity load resistance
Low temperature resistance 1. No mechanical damage 2. Impedance shall not change more than 30 % Thermal shock
CHIP BEAD, Reliability & Test Condition
Vibration
Drop
W
R0.5
0.7 0.5 0.7 0.7
1.0 0.8 1.3 2.0
1.0 1.0 1.3 4.0
1.3 1.5 3.0 5.0
1.5 3.6 3.0 5.0
1.5 3.6 3.8
Flexure strength
C
A
5.0
B
20
A
50
W
Bending strength The terminal electrode shall be neither break off nor the chip damage
R340
2 mm Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size 1005 1608 2012 3216 4516 4532 Q'TY(PCS) 10,000 4,000 4,000 3,000 2,000 1,000 0.85 T size Remarks
v Reel Dimension
CHIP BEAD, Packaging
(Unit:mm)
A 1782 D 40.8 B 50 min. E 20.2 C 130.5 W 91.5
v Leader & Blank Portion
(Unit:mm)
Blank 35050 mm 60 Pitch Chips Blank 35050 mm 60 Pitch Leader 150 min
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
B
S
P
(Unit:mm)
Type 1005 1608 2012
A 0.1 1.15 1.80 2.30
B 0.1 0.65 1.00 1.55
P 0.1 2.0 4.0 4.0
S 0.1 1.0 2.0 2.0
T (Max.) 0.8 1.1 1.1
CHIP BEAD, Packaging
v Taping Dimensions (Emboss tape)
(Unit:mm) Type 2012 3216 4516 4532 A 0.1 2.25 3.50 4.90 4.85 B 0.1 1.45 1.85 1.90 3.60 C 0.1 1.50 1.25 1.35 1.40 D 0.1 0.23 0.23 0.30 0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating 230 180 150
Soldering 2455
Cooling
10 sec. max.
60~120 sec.
30~60 sec.
60 sec. min.
CHIP BEAD, Soldering Profile
v Flow Soldering
Pre - heating 250 180 150
Soldering 2505
Cooling
60 sec. min.
10 sec. max.
60 sec. min.
v Manual Soldering
300 Soldering Iron : 30W max. Diameter of soldering iron : 1.2 mm max. 2 sec. max.
Tc
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD

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